Table 6. Parameter Rating AVDD to AGND ?0.3 V to +2.0 V DRVDD to AGND ?0.3 V to +3.9 V VIN+A, VIN+B, VIN?A, VIN?B to AGND ?0.3 V to AVDD+ 0.2 V CLK+, CLK? to AGND ?0.3 V to AVDD + 0.2 V SYNC to AGND ?0.3 V to DRVDD + 0.3 V VREF to AGND ?0.3 V to AVDD + 0.2 V SENSE to AGND ?0.3 V to AVDD + 0.2 V VCM to AGND ?0.3 V to AVDD + 0.2 V RBIAS to AGND ?0.3 V to AVDD + 0.2 V CSB to AGND ?0.3 V to DRVDD+ 0.3 V SCLK/DFS to AGND ?0.3 V to DRVDD+ 0.3 V SDIO/DCS to AGND ?0.3 V to DRVDD+ 0.3 V OEB to AGND ?0.3 V to DRVDD + 0.3 V PDWN to AGND ?0.3 V to DRVDD + 0.3 V D0x through D15x to AGND ?0.3 V to DRVDD + 0.3 V DCOx to AGND ?0.3 V to DRVDD + 0.3 V Operating Temperature Range (Ambient) ?40°C to +85°C Maximum Junction Temperature Under Bias 150°C Storage Temperature Range (Ambient) ?65°C to +150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL CHARACTERISTICS The exposed paddle is the only ground connection for the chip. The exposed paddle must be soldered to the AGND plane of the user PCB. Soldering the exposed paddle to the user board also increases the reliability of the solder joints and maximizes the thermal capability of the package. Table 7. Thermal Resistance Package Type Airflow Velocity (m/sec) θJA1, 2 θJC1, 3 θJB1, 4 Unit 64-Lead LFCSP 9 mm × 9 mm (CP-64-4) 0 23 2.0 °C/W 1.0 20 12 °C/W 2.5 18 °C/W 1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board. 2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air). 3 Per MIL-Std 883, Method 1012.1. 4 Per JEDEC JESD51-8 (still air). Typical θJA is specified for a 4-layer PCB with a solid ground plane. As shown in Table 7, airflow improves heat dissipation, which reduces θJA. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes, reduces the θJA.