HC-49SMD 貼片2P 請(qǐng)點(diǎn)擊您需要的參數(shù)一起加到購(gòu)物車,找不到您需要的請(qǐng)聯(lián)系客服 標(biāo)準(zhǔn)頻率 負(fù)載電容 頻率偏差 點(diǎn)擊購(gòu)買 3.6864MHZ 20PF 20PPM rel="nofollow" Buy 4MHZ 20PF 20PPM rel="nofollow" Buy 6MHZ 20PF 20PPM rel="nofollow" Buy 7.3728MHZ 20PF 20PPM rel="nofollow" Buy 8MHZ 20PF 20PPM rel="nofollow" Buy 10MHZ 20PF 20PPM rel="nofollow" Buy 11.0592MHZ 20PF 20PPM rel="nofollow" Buy 12MHZ 20PF 20PPM rel="nofollow" Buy 13.560MHZ 20PF 20PPM rel="nofollow" Buy 16.384MHZ 20PF 20PPM rel="nofollow" Buy 20MHZ 20PF 20PPM rel="nofollow" Buy 22.1184MHZ 20PF 20PPM rel="nofollow" Buy 24.576MHZ 20PF 20PPM rel="nofollow" Buy 24MHZ 20PF 20PPM rel="nofollow" Buy 25MHZ 20PF 20PPM rel="nofollow" Buy 26MHZ 20PF 20PPM rel="nofollow" Buy 27.120MHZ 20PF 20PPM rel="nofollow" Buy 27MHZ 20PF 20PPM rel="nofollow" Buy 28.6363MHZ 20PF 20PPM rel="nofollow" Buy 30MHZ 20PF 20PPM rel="nofollow" Buy 32MHZ 20PF 20PPM rel="nofollow" Buy 如您需要購(gòu)買同類別的其他系列產(chǎn)品，請(qǐng)點(diǎn)擊以下鏈接 產(chǎn)品型號(hào) 產(chǎn)品規(guī)格 點(diǎn)擊購(gòu)買 HC-49US 11.5x4.5x3.68mm rel="nofollow" Buy HC-49SMD 11.4x4.8x3.8mm rel="nofollow" Buy HC-49UM 11.05x4.65x13.46mm rel="nofollow" Buy YSX321SL 3225 4P rel="nofollow" Buy YSX530GA 5032 2P rel="nofollow" Buy YSX531SL 5032 4P rel="nofollow" Buy YT-26 2060 2P rel="nofollow" Buy YT-38 3080 2P rel="nofollow" Buy R315 D11,F11,TO39 rel="nofollow" Buy R433 D11,F11,TO39 rel="nofollow" Buy 石英晶振壓封條件 影響石英晶振平行封焊的因素還有夾具的設(shè)計(jì)、電極的位置、上蓋的質(zhì)量和上蓋與基座的匹配等，另外封焊設(shè)備本身的可靠性也是影響封焊質(zhì)量的因素之一。 夾具孔位的中心與轉(zhuǎn)臺(tái)中心要一致，夾具夾牢基座，否則焊接過(guò)程中電極可能會(huì)把基座粘起來(lái)；左、右電極位置保持在同一高度和同一水平線上且盡量對(duì)稱；電極滾輪要定期打磨和更換、否則會(huì)影響焊接均勻性；上蓋尺寸不能太大或太小，而且拐角有傾角，因?yàn)殚L(zhǎng)方形基座的焊接電極與上蓋角接觸兩次，焊接熱量會(huì)影響焊接效果；采用邊緣有傾角的上蓋，焊接時(shí)錯(cuò)位的可能性會(huì)大大減小。 工藝參數(shù)的設(shè)定要根據(jù)各公司的現(xiàn)狀而定，只有優(yōu)化工藝參數(shù)，才能提高石英晶振焊接質(zhì)量。在石英晶振封焊完產(chǎn)品后，對(duì)封裝過(guò)程中出現(xiàn)的現(xiàn)象進(jìn)行適當(dāng)?shù)目偨Y(jié)，有待封裝技術(shù)的進(jìn)一步提高。 真空平行縫焊（真空度在無(wú)負(fù)載、無(wú)封焊動(dòng)作時(shí)可達(dá)1.1×10-3Pa），是在短邊封焊時(shí)加一道抽真空（真空度可達(dá)5×10-2Pa），后再封焊，其結(jié)果能大大的改善晶體的電阻指標(biāo)（可下降30~50%），適用于小尺寸、高指標(biāo)的產(chǎn)品。 平行封焊有半自動(dòng)機(jī)，只完成上蓋點(diǎn)焊；滾焊密封由另一臺(tái)設(shè)備完成，中間銜接有人工搬運(yùn)。全自動(dòng)機(jī)是將真空烘烤、上蓋、點(diǎn)焊，滾焊密封、收納一機(jī)完成。